nichia sts - da1 - 3955d nichia corporation specifications for warm white led NJSL172AT pb built rohs compliant iatf 16949 compliant
nichia sts - da1 - 3955d 1 specifications (1) absol ute maximum ratings item symbol absolute maximum rating unit forward current i f 450 ma pulse forward current i fp 900 ma allowable reverse current i r 85 ma power dissipation p d 1.55 w operating temperature t opr - 40~125 c storage temperature t stg - 40~ 125 c junction temperature t j 150 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =350ma 3.15 - v luminous flux v i f =350ma 110 - lm chromaticity coordinate x - i f =350ma 0.41 - - y i f =350ma 0.39 - thermal resistance r js_real - 13.2 18.9 c/w r js_el - 10.5 13.7 * characteristics at t s =25c. * luminous flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * thermal resistance values (r js_real ) determined by considering the energy conversion efficiency. refer to jesd51.
nichia sts - da1 - 3955d 2 ranks item rank min max unit forward voltage - 2.70 3.45 v luminous flux p19 121.1 144.0 lm p18 101.8 121.1 p17 85.6 101.8 p16 72.0 85.6 color ranks rank d1 x 0.3575 0.3610 0.3780 0.3988 0.3897 0.3720 y 0.3612 0.3850 0.3970 0.4116 0.3823 0.3714 rank d2 x 0.3545 0.3575 0.3720 0.3897 0.3822 0.3667 y 0.3408 0.3612 0.3714 0.3823 0.3580 0.3484 rank e1 x 0.3897 0.3988 0.4162 0.4390 0.4255 0.4053 y 0.3823 0.4116 0.4200 0.4310 0.4000 0.3907 rank e2 x 0.3822 0.3897 0.4053 0.4255 0.4129 0.3954 y 0.3580 0.3823 0.3907 0.4000 0.3725 0.3642 rank f3 rank f4 x 0.4255 0.4390 0.4680 0.4519 x 0.4519 0.4680 0.4970 0.4770 y 0.4000 0. 4310 0.4385 0.4086 y 0.4086 0.4385 0.4466 0.4137 rank f5 rank f6 x 0.4129 0.4255 0.4519 0.4355 x 0.4355 0.4519 0.4770 0.4588 y 0.3725 0.4000 0.4086 0.3785 y 0.3785 0.4086 0.4137 0.3838 rank sw27 rank sw30 x 0.4373 0.4562 0.4813 0.4593 x 0. 4147 0.4299 0.4562 0.4373 y 0.3893 0.4260 0.4319 0.3944 y 0.3814 0.4165 0.4260 0.3893 rank sw35 rank sw40 x 0.3898 0.3996 0.4299 0.4147 x 0.3670 0.3736 0.3996 0.3898 y 0.3716 0.4015 0.4165 0.3814 y 0.3578 0.3874 0.4015 0.3716 * ranking at t s =2 5c. * forward voltage tolerance: 0.05v * luminous flux tolerance: 7% * chromaticity coordinate tolerance: 0.01 * leds from the above ranks will be shipped. the rank combination ratio per shipment will be decided by nichia.
nichia sts - da1 - 3955d 3 luminous flux ranks by color rank ranking by luminous flux ranking by color coordinates p16 p17 p18 p19 d1,d2,e1,e2,sw35,sw40 f3,f4,f5,f6,sw27,sw30
nichia sts - da1 - 3955d 4 chromaticity diagram d1 d2 e1 e2 f3 f4 f5 f6 sw27 sw30 sw35 sw40 4260k 3710k 3220k 2870k 2580k 0.30 0.35 0.40 0.45 0.50 0.30 0.35 0.40 0.45 0.50 y x \?E blackbody locus
nichia sts - da1 - 3955d 5 outline dimensions s t s - d a 7 - 0 4 5 9 c n j s x 1 7 2 x n o . ( g u n i t : m m ) t h i s p r o d u c t c o m p l i e s w i t h r o h s d i r e c t i v e . u ? r o h s ? m * ( g u n i t : m m , t o l e r a n c e : 0 . 2 ) 0 . 5 2 . 7 2 . 7 1 c a t h o d e a n o d e 0 . 8 ( 2 . 3 ) 3 3 ( 2 . 3 ) c a t h o d e m a r k k a o p r o t e c t i o n d e v i c e ? i t e m ` | p a c k a g e m a t e r i a l s ? ? | e n c a p s u l a t i n g r e s i n m a t e r i a l s O | e l e c t r o d e s m a t e r i a l s | w e i g h t d e s c r i p t i o n c e r a m i c s ` ? ? + w s i l i c o n e r e s i n ( w i t h d i f f u s e r a n d p h o s p h o r ) a u - p l a t e d 0 . 0 2 4 g ( t y p ) t h e d i m e n s i o n ( s ) i n p a r e n t h e s e s a r e f o r r e f e r e n c e p u r p o s e s . *
nichia sts - da1 - 3955d 6 soldering ? recommended reflow soldering condition(lead ? recommended hand soldering condition recommended soldering pad pattern * this led is designed to be reflow soldered to a pcb. if dip soldered, nichia will no t guarantee its reliability. * reflow soldering must not be performed more than twice. hand soldering must not be performed more than once. * when cooling the leds from the peak temperature a gradual cooling slope is recommended; do not cool the leds rap idly. * during reflow soldering, the heat and atmosphere in the reflow oven may cause the optical characteristics to degrade. in pa rticular, reflow soldering performed with an air atmosphere may have a greater negative effect on the optical characteristic s than if a nitrogen atmosphere is used; nichia recommends using a nitrogen reflow atmosphere. * this led uses a silicone resin for the encapsulating resin; the silicone resin is soft. if pressure is applied to the silic one resin, it may cause the resin t o be damaged, chipped, delaminated and/or deformed. if the resin is damaged, chipped, delaminated and/or deformed, it may cause the wire to break causing a catastrophic failure (i.e. the led not to illuminate) and/or reliab ility issues (e.g. the led to cor rode and/or to become dimmer, the color/directivity to change, etc.). ensure that pressure is not applied to the encapsulating resin. * once the leds have been soldered to a pcb, it should not be repaired/reworked. if it must be done, using a double - head soldering iron is strongly recommended. ensure that sufficient verification is performed prior to use to ensure that the repair/rework has not caused the led characteristics to deteriorate. * when soldering, do not apply stress to the led while the led is hot. * when using an automatic pick - and - place machine, choose an appropriate nozzle for this led. using a pick - and - place nozzle with a smaller diameter than the size of the led's emitting surface will cause damage to the emitting surface causing a catast rophic failure (i.e. the led not to illuminate). * the soldering pad pattern above is a general recommendation for leds to be mounted without issues; if a high degree of prec ision is required for the chosen application (i.e. high - density mounting), ensure that the soldering pad pattern is optimized. * consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * when flux is used, it should be a halogen free flux. ensure that the manufacturing pro cess is not designed in a manner where the flux will come in contact with the leds. * ensure that there are no issues with the type and amount of solder that is being used. 120sec m ax pre - heat 180 to 200 c 260c m ax 10sec m ax 60sec m ax above 220c 1 to 5c per sec ( g u n i t : m m ) 3 0 . 5 3 . 6
nichia sts - da1 - 3955d 7 tape and reel dimensions s t s - d a 7 - 0 0 6 4 c r e e l s i z e : 4 0 0 0 p c s 1 ` 4 0 0 0 * n x x x 1 7 2 x ` t a p e 4 0 . 1 1 . 7 5 0 . 1 4 0 . 1 2 0 . 0 5 3 . 5 0 . 0 5 - 0 1 . 5 + 0 . 1 8 + 0 . 3 - 0 . 1 ` r e e l f 1 3 0 . 2 f 2 1 0 . 8 l a b e l 2 1 0 . 8 1 3 0 . 2 1 1 . 4 1 9 0 . 3 6 0 + 1 - 0 1 8 0 + 0 - 3 t h e t a p e p a c k i n g m e t h o d c o m p l i e s w i t h j i s c 0 8 0 6 ( p a c k a g i n g o f e l e c t r o n i c c o m p o n e n t s o n c o n t i n u o u s t a p e s ) . * j i s c 0 8 0 6 ? ` n o . ( g u n i t : m m ) 3 . 3 0 . 1 0 . 2 0 . 0 5 1 . 0 5 0 . 1 3 . 3 0 . 1 c a t h o d e m a r k - 0 1 + 0 . 2 5 ` / ` t r a i l e r a n d l e a d e r t o p c o v e r t a p e l e d ? ` m i n 4 0 0 m m ` m i n 1 6 0 m m t r a i l e r 1 6 0 m m m i n ( e m p t y p o c k e t s ) l o a d e d p o c k e t s ` e m b o s s e d c a r r i e r t a p e ` ` f e e d d i r e c t i o n l e a d e r w i t h o u t t o p c o v e r t a p e 4 0 0 m m m i n m i n 1 0 0 m m l e a d e r w i t h t o p c o v e r t a p e 1 0 0 m m m i n ( e m p t y p o c k e t ) w h e n t h e t a p e i s r e w o u n d d u e t o w o r k i n t e r r u p t i o n s , n o m o r e t h a n 1 0 n s h o u l d b e a p p l i e d t o t h e e m b o s s e d c a r r i e r t a p e . t h e l e d s m a y s t i c k t o t h e t o p c o v e r t a p e . * g ? I ` ` ? ` ( 1 0 n ) l e d ` ` N
nichia sts - da1 - 3955d 8 packaging - tape & reel n i c h i a l e d s t s - d a 7 - 0 0 0 6 c n x x x x x x x l a b e l l a b e l n o . r e e l ` ` s e a l m o i s t u r e - p r o o f b a g ? r o h s n x x x x x x x x x x x l e d * * * * * * * n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n t y p e l o t q t y . y m x x x x - r r r p c s r o h s n x x x x x x x x x x x l e d * * * * * * * r r r p c s t y p e r a n k q t y . n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n r e e l s a r e s h i p p e d w i t h d e s i c c a n t s i n h e a t - s e a l e d m o i s t u r e - p r o o f b a g s . ` ? ` d e s i c c a n t s m o i s t u r e - p r o o f b a g s a r e p a c k e d i n c a r d b o a r d b o x e s w i t h c o r r u g a t e d p a r t i t i o n s . ? K ` ` ? y ? ? * ? \ H y ? B ? y * ? Q H n u ? p ? ? * u s i n g t h e o r i g i n a l p a c k a g e m a t e r i a l o r e q u i v a l e n t i n t r a n s i t i s r e c o m m e n d e d . d o n o t e x p o s e t o w a t e r . t h e b o x i s n o t w a t e r - r e s i s t a n t . d o n o t d r o p o r e x p o s e t h e b o x t o e x t e r n a l f o r c e s a s i t m a y d a m a g e t h e p r o d u c t s . p r o d u c t s s h i p p e d o n t a p e a n d r e e l a r e p a c k e d i n a m o i s t u r e - p r o o f b a g . t h e y a r e s h i p p e d i n c a r d b o a r d b o x e s t o p r o t e c t t h e m f r o m e x t e r n a l f o r c e s d u r i n g t r a n s p o r t a t i o n . * u ? ` ? n o ` y i f n o t p r o v i d e d , i t w i l l n o t b e i n d i c a t e d o n t h e l a b e l . * * * * * * * i s t h e c u s t o m e r p a r t n u m b e r . O * * * * * * * * ? f o r d e t a i l s , s e e " l o t n u m b e r i n g c o d e " i n t h i s d o c u m e n t . * ? t h e l a b e l d o e s n o t h a v e t h e r a n k f i e l d f o r u n - r a n k e d p r o d u c t s . * ?
nichia sts - da1 - 3955d 9 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2017 h 2018 i 2019 j 2020 k 2021 l 2022 m m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx - nichi a's product number rrr - ranking by color coordinates, ranking by luminous flux
nichia sts - da1 - 3955d 10 derating characteristics njsx172a ? no. sts-da7-6242c 0 100 200 300 400 500 0 30 60 90 120 150 derating1 (68, 450) (125, 137) 0 100 200 300 400 500 0 30 60 90 120 150 derating2 (125, 450) 10 100 1000 1 10 100 duty 450 900 S allowable forward current(ma) ???? ( `? ) - S solder temperature(cathode side) vs allowable forward current ?? - S ambient temperature vs allowable forward current S allowable forward current(ma) S allowable forward current(ma) ???? ( `? ) solder temperature(cathode side)( c) ?? ambient temperature( c) ?`?` duty ratio(%) ?`?` - S duty ratio vs allowable forward current 55 c/w ja r = t a =25 c
nichia sts - da1 - 3955d 11 optical characteristics njsl172a ? no. sts-da7-8112a 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 750 800 spectrum ? relative illuminance(a.u.) 90 80 70 60 50 40 30 20 10 0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 350ma i fp = t a =25 c 350ma i fp = t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts - da1 - 3955d 12 forward current characteristics / temperature characteristics njsl172a ? no. sts-da7-8113a 2.0 2.5 3.0 3.5 4.0 -60 -30 0 30 60 90 120 150 tavf 0.4 0.6 0.8 1.0 1.2 1.4 -60 -30 0 30 60 90 120 150 taiv 10 100 1000 2.0 2.5 3.0 3.5 4.0 vfif 350 900 relative luminous flux(a.u.) ?? - ambient temperature vs relative luminous flux forward current(ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 200 400 600 800 1000 ifiv relative luminous flux(a.u.) - forward current vs relative luminous flux forward current(ma) ?R - forward voltage vs forward current ?? - ?R ambient temperature vs forward voltage ?R forward voltage(v) ?R forward voltage(v) ?? ambient temperature( c) ?? ambient temperature( c) * ??? all characteristics shown are for reference only and are not guaranteed. =25 c t a i fp = 350ma i fp = 350ma t a =25 c
nichia sts - da1 - 3955d 13 forward current characteristics / temperature cha racteristics njsl172a ? no. sts-da7-8114a 0.37 0.38 0.39 0.40 0.41 0.38 0.39 0.40 0.41 0.42 taxy - 40?c 0?c 25?c 125?c x 0.37 0.38 0.39 0.40 0.41 0.38 0.39 0.40 0.41 0.42 ifxy 20ma 100ma 350ma 450ma 900ma x y y 350ma i fp = ?? - ? ambient temperature vs chromaticity coordinate - ? forward current vs chromaticity coordinate t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts - da1 - 3955d 14 reliability (1) tests and results test reference standard test conditions test duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed - 4701 300 301 t sld =260 c, 10sec, 2reflows, preconditi on: 30 c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed - 4701 303 303a t sld =245 5 c, 5sec, lead - free solder(sn - 3.0ag - 0.5cu) #2 0/22 thermal shock jeita ed - 4701 300 307 - 40 c to 125 c, 1min dwell, 10sec transfer, precondition: 30 c, 70%r h, 168hr 100cycles #1 0/50 temperature cycle jeita ed - 4701 100 105 - 40 c(30min)~25 c(5min)~ 125 c(30min)~25 c(5min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed - 4701 200 203 25 c~65 c~ - 10 c, 90%rh, 24hr per cycle 10cycles #1 0/50 high tempera ture storage jeita ed - 4701 200 201 t a =125 c 1000hours #1 0/50 temperature humidity storage jeita ed - 4701 100 103 t a =60 c, rh=90% 1000hours #1 0/50 low temperature storage jeita ed - 4701 200 202 t a = - 40 c 1000hours #1 0/50 room temperature operating life t a =25 c, i f =450ma test board: see notes below 1000hours #1 0/50 high temperature operating life t a =125 c, i f =137ma test board: see notes below 1000hours #1 0/50 temperature humidity operating life 60 c, rh=90%, i f =350ma test board: see notes below 1000 hours #1 0/50 low temperature operating life t a = - 40 c, i f =350ma test board: see notes below 1000hours #1 0/50 permanence of marking jeita ed - 4701 500 501 isopropyl alcohol, 23 5 c, dipping time: 5min 1time #1 0/22 vibration jeita ed - 4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/10 electrostatic discharges jeita ed - 4701 300 304 hbm, 2kv, 1.5k , 100pf, 3pulses, alternately positive or negative #1 0/22 notes: 1) test board: fr4 board thickness=1.6mm, copper lay er thickness=0.07mm, r ja 55c/w 2) measurements are performed after allowing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria #1 forward voltage(v f ) i f =350ma >initial value 1.1 luminous fl ux( v ) i f =350ma nichia sts - da1 - 3955d 15 cautions (1) storage conditions temperature humidity time storage before opening aluminum bag 30 c 90%rh within 1 year from delivery date after opening aluminum b ag 30 c 70%rh 168hours baking 65 5 c - 24hours the storage/packaging requirements for this led are comparable to jedec moisture sensitivity level (msl) 3 or equivalent. nichia used ipc/jedec std - 020 as a reference to rate the msl of this led. t his led uses a package that could absorb moisture; if the package absorbs moisture and is exposed to heat during soldering, i t may cause the moisture to vaporize and the package to expand and the resulting pressure may cause internal delamination. this may cause the optical characteristics to degrade. to minimize moisture absorption in storage/transit, moisture - proof aluminum bags are used for the leds with a silica gel packet to absorb any air moisture in the bag. the silica gel beads turn blue to red as t hey absorb moisture. once the moisture - proof aluminum bag is open, ensure that the led is soldered to a pcb within the range of the conditions above. to store any remaining unused leds, use a hermetically sealed container with silica gel desiccants. nichia recommends placin g them back to the original moisture - proof bag and reseal it. if the after opening storage time has been exceeded or any pink silica gel beads are found, ensure that the led are baked before use. baking should only be done once. this led has gold - p lated electrodes. if the leds are exposed to a corrosive environment, it may cause the plated surface to tarnish causing issues (i.e. solderability). ensure that when storing leds, a hermetically sealed container is used. nichia recommends placing them bac k to the original moisture - proof bag and reseal it. to prevent substances/gases from affecting the plated surface, ensure that the parts/materials used with the leds in the sa me assembly/system do not contain sulfur (e.g. gasket/seal, adhesive, etc.). if the plating is contaminated, it may cause issues (e .g. electric connection failures). if a gasket/seal is used, silicone rubber gaskets/seals are recommended; ensure that this use of silicone does not result in issues (e.g. electrical connection failures) caused by low molecular weight volatile siloxane. to avoid condensation, the leds must not be stored in areas where temperature and humidity fluctuate greatly. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment over a long period of time w here the temperature is higher than normal room temperature. (2) directions for use the circuit must be designed to ensure that the absolute maximum ratings are not exceeded for each led. the leds should be operated at a constant current per led. in th e case of operating at a constant voltage, circuit b is recommended. if circuit a is used, it may cause the currents flowing through the leds to vary due to the variation in the forward voltage characteristics of the leds on the circuit. this led is d esigned to be operated at a forward current. ensure that no voltage is applied to the led in the forward/reverse direction while the led is off. if the leds are used in an environment where reverse voltages are applied to the led continuo usly, it may cause electrochemical migration to occur causing the led to be damaged. when not in use for a long period of time, the systems power should be turned off to ensure that there are no issues/damage. to stabilize the led characteristics while in use, nichia recommends that the leds are operated at currents 10% of the so rting current. ensure that transient excessive voltages (e.g. lighting surge) are not applied to the leds. if the leds are us ed for outdoor applications, ensure that necessary measures are taken (e.g. protecting the leds from water/salt damage and high humidity). ( a ) . . . ( b ) . . .
nichia sts - da1 - 3955d 16 (3) handling precautions do not handle the leds with bare hands: - this may contaminate the led surface an d have an effect on the optical characteristics, - this may cause the led to deform and/or the wire to break causing a catastrophic failure (i.e. the led not to illuminate). ensure that when handling the leds with tweezers, excessive force is not applied to the led. otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the wire to break causing a catastrophic failure (i.e. the led not to illuminate). dropping may cause damage to the led ( e.g. deformation). do not stack assembled pcbs together. otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack, delamina tion and deformation) and the wire to break causing a catastrophic failure (i.e. the led not to illuminate). ( 4) design consideration if the leds are soldered to a pcb and the pcb assembly is bent (e.g. pcb depaneling process), it may cause the led package to break. the pcb layout should be designed to minimize the mechanical stress on the leds when the pcb ass embly is bent/warped. the amount of mechanical stress exerted on the led from depaneling may vary depending on the led position/orientation on th e pcb assembly (e.g. especially in areas near v - groove scores). the pcb layout should be designed to minimiz e the mechanical stress on the leds when the pcb is separated into individual pcb assemblies. to separate a pcb populated with the leds, use a specially designed tool. do not break the pcb by hand. if an aluminum - core pcb is used to operate the leds, it may cause thermal stress during operation causing damage to the solder joints (e.g. crack). ensure that sufficient verification is performed prior to use. volatile organic compounds that have been released from materials present around the leds (e. g. housing, gasket/seal, adhesive, secondary lens, lens cover, etc.) may penetrate the led lens and/or encapsulating resin. if the leds are being used in a hermetically sealed environment, these volatile compounds can discolor after being exposed to heat a nd/or photon energy and it may greatly reduce the led light output and/or color shift. in this case, ventilating the environment may improve the redu ction in light output and/or color shift. perform a light - up test of the chosen application for optical eva luation to ensure that there are no issues, especially if the leds are planned to be used in a hermetically sealed environment. (5) electrostatic discharge (esd) this led is sensitive to transient excessive voltages (e.g. esd, lightning surge). if this excessive voltage occurs in the circuit, it may cause the led to be damaged causing issues (e.g. the led to become dimmer or not to illuminate [i.e. catastrophic failure]). ensure that when handling the leds, necessary measures are taken to protect them from an esd discharge. the following examples are recommended measures to eliminate the charge: - grounded wrist strap, esd footwear, clothes, and floors - grounded workstation equipment and tools - esd table/shelf mat made of conductive materials ensure that all necessary measures are taken to prevent the leds from being exposed to transient excessive voltages (e.g. e sd, lightning surge): - tools (e.g. soldering irons), jigs, and machines that are used are properly grounded - approp riate esd materials/equipment are used in the work area - the system/assembly is designed to provide esd protection for the leds. if the tool/equipment used is an insulator (e.g. glass cover, plastic, etc.), ensure that necessary measures have be en taken to protect the led from transient excessive voltages (e.g. esd). the following examples are recommended measures to eliminate the charge: - dissipating static charge with conductive materials - preventing charge generation with moistur e - neutralizing the charge with ionizers to detect if an led was damaged by transient excess voltages (i.e. an esd event during the systems assembly process), perf orm a characteristics inspection (e.g. forward voltage measurement, light - up test) at low current (1ma). failure criteria: v f <2.0v at i f =0.5ma if the led is damaged by transient excess voltages (e.g. esd), it will cause: - the forward voltage (v f ) to decrease - the led not to illuminate at a low current
nichia sts - da1 - 3955d 17 (6) thermal management the absolute maximum junction temperature (t j ) must not be exceeded under any circumstances. the increase in the temperature of an led while in operation may vary depending on the pcb thermal resistance and the density of leds on the pcb asse mbly. ensure that when using the leds for the chosen application, heat is not concentrated in an area and properly managed in the system/assembly. the operating current should be determined by considering the temperature conditions surrounding the led ( i.e. t a ). ensure that when operating the led, proper measures are taken to dissipate the heat. the following two equations can be used to calculate the led junction temperature: 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperatur e: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measurement point: c/w w=input power(i f v f ): w (7) cleaning do not clean the leds with water, benzine and/or thinner. to clean the leds, use isopropyl alcohol (ipa). if another solvent is used, it may cause the led package/resin to be damage d causing issues; ensure that sufficient verificat ion is performed prior to use. additionally, ensure that the solvent being used does not cause any other issues (e.g. cfc - based solvents are heavily regulated). if an led is contaminated (e.g. dust/dirt), use a cloth soaked with isopropyl alcohol (ipa). ensure that the cloth is firmly squeezed before wiping the led. do not clean the leds with an ultrasonic cleaner. if cleaning must be done, ensure that sufficient verification is performe d by using a finished assembly with leds to determine cleaning co nditions (e.g. ultrasonic power, led position on the pcb assembly) that do not cause an issue. (8) eye safety there may be two important international specifications that should be noted for safe use of the leds: iec 62471:2006 photobiological safety o f lamps and lamp systems and iec 60825 - 1:2001 (i.e. edition 1.2) safety of laser products - part 1: equipment classification and requirements. ensure that when using the leds, there are no issues with the following points: - leds have been removed fr om the scope of iec 60825 - 1 since iec 60825 - 1:2007 (i.e. edition 2.0) was published. however, depending on the country/region, there are cases where the requirements of the iec 60825 - 1:2001 specifications or equivalent must be adhered to. - leds have been included in the scope of iec 62471:2006 since the release of the specification in 2006. - most nichia leds will be classified as the exempt group or risk group 1 according to iec 62471:2006. however, in the case of high - power leds containing blue wavelengths in the emission spectrum, there are leds that will be classified as risk group 2 depending on the characteristics (e.g. radiation flux, emission spectrum, directivity, etc.) - if the led is used in a man ner that produces an increased output or with an optic to collimate the light from the led, it may cause damage to the human eye. if an led is operated in a manner that emits a flashing light, it may cause health issues (e.g. visual stimuli caus ing eye discomfort). the system should be designed to ensure that there are no harmful effects on the human body. t s m e a s u r e m e n t p o i n t
nichia sts - da1 - 3955d 18 (9) miscellaneous nichia warrants that the discrete leds will meet the requirements/criteria as detailed in the reliability section withi n this specification. if the leds are used under conditions/environments deviating from or inconsistent with those described in this specification, the resulting damage and/or injuries will not be covered by this warranty. nichia warrants that the discr ete leds manufactured and/or supplied by nichia will meet the requirements/criteria as detailed in the reliability section within this specification; it is the customers responsibility to perform sufficient verification pri or to use to ensure that the lif etime and other quality characteristics required for the intended use are met. the applicable warranty period is one year from the date that the led is delivered. in the case of any incident that appear s to be in breach of this warranty, the local nichi a sales representative should be notified to discuss instructions on how to proceed while ensuring that the led in question is not disassembled or removed from the pcb if it has been attached to the pcb. if a breach of this warranty is proved, nichia will provide the replacement for the non - conforming led or an equivalent item at nichias discretion. foregoing are the exclusive remedies available to the customer in respect of the breach of the warranty contained herein, and in no event shall nichia be respo nsible for any indrect, incidental or consequential losses and/or expenses (including loss of profit) that may be suffered by the customer arising out of a breach of the warranty. nichia disclaims all other warranties, express or implied, including the implied warranties of merchantability and fitness for a particular purpose. this led is intended to be used for general lighting, household appliances, electronic devices (e.g. mobile communication d evices) and automobiles; it is not designed or manufac tured for use in applications that require safety critical functions (e.g. aircraft, combustion equipment, life support systems, nuclear reactor control system, safety devices, spacecraft, submarine repeaters, traffic control equipment, trains, vessels, et c.). if the leds are planned to be used for these applications, unless otherwise detailed in the specification, nichia will neither guarantee that the led is fit for that purpose nor be responsible for any resulting property damage, injuries and/or loss of life/health. the customer will not reverse engineer, disassemble or otherwise attempt to extract knowledge/design information from the l ed. all copyrights and other intellectual property rights in this specification in any form are reserved by nichi a or the right holders who have granted nichia permission to use the content. without prior written permission from nichia, no part of this specificatio n may be reproduced in any form or by any means. both the customer and nichia will agree on the offic ial specifications for the supplied leds before any programs are officially launched. without this agreement in writing (i.e. customer specific specification), changes to the content of this specificat ion may occur without notice (e.g. changes to the foreg oing specifications and appearance, discontinuation of the leds, etc.).
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